Significant breakthroughs have been made in the application of high-purity fused silica powder in the semiconductor industry
High-purity molten silica powder is a colorless, odorless, and non-toxic powder with high chemical and thermal stability. Its melting point is 1713 ℃, boiling point is 2230 ℃, and it has high thermal stability. In addition, it has characteristics such as high hardness, high corrosion resistance, high transparency, and high insulation.